Modification Structure of Tin-Based Alloys and Effects on their Properties for Electronic Industrial

Abstract

The aim of research is to design alloy with superior solder properties as a solder in industrial applications.  To do that, different experimental techniques were used to study the structure and physical properties of tin (Sn) based alloy with added antimony (Sb)- bismuth (Bi)- zinc (Zn).  Choosing different ratio from these alloying elements to improve soldering properties.  X-ray analysis and scanning electron micrographs for Sn_93-xSb₇Bi_x (x=0, 8, 18 and 28) and SnSb₇Bi₁₈Zn₃ alloys show tetragonal β- Sn, rhombohedral Bi phase, Sb-Sn and Sn-Bi intermetallic phases with dissolved atoms as a soild solution.  Adding bismuth to Sn₉₃Sb₇ alloy decreased crystal size and melting temperature with increasing hardness.  SnSb₇Bi₁₈Zn₃ alloy has superior solder properties as melting temperature and wettability for electronic industrial application.